MP 5405 is a two part unfilled
epoxy adhesive designed for ceramics, and most plastics. It
cures to a tough semi-rigid material, and is free flowing
in viscosity. It gives good resistance to water, salt spray,
inorganic acids and bases, and most organic solvents. It was
especially formulated to a 1:1 mix ratio for use in either
MMD equipment or side-by-side dual cartridges for easy dispensing.
A handling cure is normally achieved at room temperature
within 20 - 30 minutes with full cure in 24 hours. An elevated
temperature cure schedule can be used to reach final properties
quickly.
Handling and Storage:
- 1) Bring both components to room temperature prior to
mixing. Mix 1 parts A to 1 part B thoroughly.
- Allow to cure undisturbed until product is fully gelled
or tack-free to the touch.
- Clean up uncured resin with suitable organic solventsuch
as MEK, acetone or a chlorinated.solvent.
Mix Ratio: 1A:1B by weight or 1A:1B by volume.
Shelf Life: 12 Months |