MP 54750 is a two part unfilled epoxy structural adhesive designed for bonding application requiring conformance to the Code of Federal Regulations Title 21 175.105 (Adhesives) and 175.300 (Resinous and polymeric coatings)1. It cures completely at room temperature to a tough, semi-rigid polymer. It has good wetting and adhesion to most surfaces and has a free flowing viscosity. It has very good resistance to water, acids and bases and most organic solvents.

It was especially formulated to a 1A:1B volume mix ratio for use in side-by-side dispensing cartridges and meter/mix and dispense equipment. MP 54750 will reach full cure at room temperature within 24 –48 hours. Cure time can be accelerated by the application of heat. Times and temperatures from 2 hours at 150F to 10 minutes at 225F are typical for most applications. Time to heat substrate must be taken into account. Cooler temperatures will also extend work time and increase cure times.